THI100布氏测量系统

THI100布氏测量系统产品介绍（中文）

THI100布氏测量系统是一款基于光学成像技术的精密硬度测量设备，专为金属材料硬度检测而设计。该系统采用高分辨率CCD摄像镜头，通过捕捉布氏压痕图像并传输至计算平台（PC或工控机），结合专用软件自动计算压痕直径，直接输出布氏硬度值，避免了传统人工读数的误差。其核心优势包括：

1. 高精度测量：配备先进CCD传感器，最高可实现3.5µm的压痕直径测量精度，适用于微小或异形压痕分析，如小口径轴类工件。
2. 自动化处理：软件自动计算布氏硬度值，无需查表换算，支持X/Y轴双向直径测量，适应非正圆压痕的复杂场景。
3. 数据管理便捷：以图片格式存储压痕图像，支持批量测量后统一计算，便于数据追溯与分析。
4. 广泛兼容性：支持2.5mm、5mm、10mm多种压头直径，覆盖8~650HBW的硬度范围，满足不同材料的测试需求。
   系统结构紧凑，含便携式计算机和模块化测量头，适用于实验室和工业现场。

THI100 Brinell Measurement System Introduction (English)

The THI100 Brinell Measurement System is a precision hardness testing device utilizing optical imaging technology, designed for metal material analysis. It features a high-resolution CCD camera to capture Brinell indentation images, which are transmitted to a computing platform (PC or industrial PC) for automatic diameter calculation and direct Brinell hardness value output, eliminating manual reading errors. Key features include:

1. High-Precision Measurement: Equipped with an advanced CCD sensor, it achieves up to 3.5µm resolution for indentation diameter measurement, ideal for微小或非标准 indentations (e.g., small shafts).
2. Automated Processing: The software automatically computes hardness values without manual conversion tables and supports bidirectional (X/Y-axis) diameter measurement for irregular indentations.
3. Efficient Data Management: Indentation images are stored in picture format, enabling batch processing and traceability.
4. Versatile Compatibility: Compatible with 2.5mm, 5mm, and 10mm indenters, covering a hardness range of 8~650HBW for diverse materials.
   The system integrates a portable computer and modular measurement head, suitable for both lab and industrial environments.

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